MesoGlue : An Alternative to Soldering

Soldering is one of the important field of Electronics in maintaining joints and connections in a circuit. But no matter how experienced an engineer is, it would have definitely encountered burns from the same. MesoGlue is an advanced adhesive that could completely replace conventional soldering technology and its effects. 

MesoGlue is developed by a team of scientists from the University of North Florida and Northeastern university. It uses a technology that creates a conductive metal bond between the items need to be bonded instead of conventional metal melted bonds. It uses a very simple process to do the bonding - just as easy as a conventional glue. Just apply it between the items and bond them togther and you are good to go.

How does it work?

MesoGlue is made of materials consisting of nanorods that act as locking agents to bond two surfaces together. Nanorods on the one surface interpenetrate the other adjacent surface need to be bonded. The nanorods are shelled inside a casing that liquifies on contact with the similar solution before getting hardened into a stong bond. MesoGlue bonds are not only conductive and easy to use but also it is durable too and can withstand upto high temperatures. Also these bonds have the capabilities to dissipate heat quickly so they easily get cooled if heated.

For now, MesoGlue cannot actually replace the conventional soldering process because MesoGlue is not as cheap as soldering and most of the people don't want to go for a newer product in that line. But it holds a great future if priced and marketed well.

To learn more about it click here

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