Ryzen 3000 with 16 cores: debut in late summer

Exactly a week ago, AMD made the debut day of the first Ryzen 3000 CPUs based on Zen 2 architecture and 7-nanometer production technology official at the opening of Computex 2019 in Taipei: it's July 7th. Five models have been anticipated so far, with the top-of - the-range version taking Ryzen 9's name and integrating 12 cores.

Ryzen 9 3900X : 12 cores, 24 threads, operating frequency of 3.8 GHz and 4.6 GHz in boost, with 70MB of cache in total (64MB L3 and 6MB L2). The TDP is 105W
Ryzen 7 3800X : 8 cores, 16 threads, operating frequency of 3.9 GHz and 4.5 GHz in boost, with 36MB of cache in total (32MB L3 and 4MB L2). The TDP is 105W
Ryzen 7 3700X : 8 cores, 16 threads, operating frequency of 3.6 GHz and 4.4 GHz in boost, with 36MB of cache in total (32MB L3 and 4MB L2). The TDP is 65W
Ryzen 5 3600X : 6 cores, 12 threads, operating frequency of 3.8 GHz and 4.4 GHz in boost, with 35MB of cache in total (32MB L3 and 3MB L2). The TDP is 95W
Ryzen 5 3600 : 6 cores, 12 threads, operating frequency of 3.6 GHz and 4.2 GHz in boost, with 35MB of cache in total (32MB L3 and 3MB L2). The TDP is 65W

AMD has adopted a structure for the Ryzen 9 3900X CPU, which sees the combination of two die with the I / O chip, with a so-called chiplet design. This is currently the only Ryzen 3000 CPU of this type, as it is sufficient to use a single die for the other versions as this internally integrates 8 cores.

However, we collected information from another version of Ryzen 9 CPU among the Computex stands that should be debuting later: this is the model with 16 cores available, a version that we believe will have slightly lower clock frequencies than the CPU Ryzen 9 3900X, but that will certainly enable very high performance with applications capable of exploiting all the available cores. Obviously there will be two die 2s in this CPU, each with 8 cores inside.

This version will not be released at the beginning of July, but at a later date between 1 and 2 months, according to our sources. This delay is dictated by the need to optimize the design and operation of the motherboards, which must be adapted to the higher power supply required by this new model, according to the rumors we collected at Computex. We do not believe that this will lead to the so-called AMD X570 chipset-based Revision 2 of the motherboards, but the compatibility between this new CPU and the models already on the market will have to be evaluated for some time, precisely because of the higher power requirements. We don't have any details about the TDP, but it should be placed over the Ryzen 9 3900X model's 105 Watts, probably touching 125 Watts.