Want to Know About Stencil Technology

Dispensing solder paste on designated locations on bare printed circuit boards has always been a challenging process. But if the solder paste isn’t dispensed properly, the board components won’t be perfectly aligned on the board. Improperly aligned board components don’t create long-lasting soldered interconnections.

So, a simple mistake when you’re dispensing solder paste on bare PCBs can technically lead to product failure. In the past, two techniques were used to dispensing solder paste on PCBs. First was the time-pressure-based technique that was carried out using valves. The second technique involved the use of auger valves. These valves were rotating threads that forced solder paste down small needles.

Although these solder-paste dispensing techniques were simple and efficient, small-scale businesses couldn’t afford to set up such systems. The introduction of PCB stencils changed this trend.
Small-scale electronic assemblies can now leverage the high speed of PCB stencil technology to carry out a wide range of solder paste dispensing techniques. Plus, the PCB stencil cost is low. Even the best stencils are affordable for small businesses.